How Femtosecond Laser Micromachining Assists In Thin Film Removal In Optoelectronics Industry

Thin film removal is an incredibly accurate method that uses selective laser ablation to strip micro-and nano-scale films from the surfaces of various substrate materials. While ‘thin’ is a blanket term, it generally involves films ranging from fractions of a nanometer (nm) to just a few micrometers (μm) in thickness. Throughout these scales, deformation and failure mechanics influence the use of abrasive machining techniques.

What is thin film?

Thin film is a layer of material found on the surfaces of the substances, which typically causes the interface to function differently than the bulk substrate. Oxidation is probably the most well-known natural cause of thin-film formation.

Other metals, such as titanium (Ti), react to exposure to air and oxygen in the atmosphere and are influenced by heat. It forms a thin surface layer of Titanium oxide (TiOx) that prevents the bulk material from further corrosion. The normal process of thin film forming is referred to as “passivation.”

Thin Film Removal in Optoelectronics

Due to its success, femtosecond laser micromachining has been established as the best method for removing thin film and the patterning of thin coatings on a wide variety of substrates. Indium tin oxide (ITO) film and electrochromic glass film are two application fields for FCPA (fiber-chirped pulse amplification) thin film removal.

Besides, femtosecond micromachining, due to its capacity for subsurface modification and high interfacial selectivity, can be used to remove thin films from a virtually unlimited variety of materials.

Selective removal of thin films from substrates allows manufacturers to create precise patterns that can be utilized as circuitry in optoelectronic devices. Common uses of femtosecond thin-film removal include solar cell patterning, liquid crystal display (LCD) manufacturing, and the manufacturing of touch-sensitive panels.

Femtosecond micromachining enables Laserod to achieve various processes, such as cutting, drilling, and turning in just about any material. When you’re searching for laser micromachining services or products, Laserod has decades of expertise in customizing laser solutions for your every need.

Whether you have difficult-to-machine modules, products, or parts, entrust them all to one of the world’s leading laser micromachining companies, Laserod. At Laserod Technologies, we are committed to delivering excellent micromachining services to various industries, such as aerospace, microelectronics, touchscreen makers, medical, transducer sensors, etc.

Contact Laserod Technologies at 1-310-340-1343 / 1-888-991-9916 for any micromaching projects and inquiries you may have!

Laserod Wafer

Laserod Wafer

Laserod Incorporated was founded by Rod Waters in the mid 1990s, succeeding Florod, a company established by Waters and a partner in the 1970s.

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